Compositions useful for preparing composites and composites produced therewith

ABSTRACT

A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 12/639,726, filed Dec. 16, 2009, now U.S. Pat. No.8,173,745, which application is incorporated by reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to compositions useful in the manufacture ofcomposites, and especially prepregs, used in the preparation ofcomposite structures, such as laminates. The invention particularlyrelates to compositions including epoxidized dicyclopentadiene and theiruse in preparing prepregs.

2. Background of the Invention

Laminates are generally manufactured by pressing, under elevatedtemperatures and pressures, various layers of partially cured“prepregs”. These prepregs are generally manufactured by impregnating athermosettable epoxy resin composition into a porous substrate, such asa glass fiber mat, followed by processing at elevated temperatures topromote a partial cure of the epoxy resin in the mat to a “B-stage.”Complete cure of the epoxy resin impregnated in the glass fiber mattypically occurs during the lamination step when the prepreg layers areagain pressed under elevated temperatures for a sufficient time.

Epoxy resin systems having a high Glass Transition Temperature (T_(g))are often desirable in the manufacture of prepregs and the laminatesprepared therewith. Such systems may offer, for example, improved heatresistance and reduced thermal expansion. These properties along withlow Dielectric Constant (D_(k)), and Dissipation frequencies (D_(f))above 1.0 GHz may be required for applications such as complex printedcircuit board circuitry and for higher fabrication and usagetemperatures.

SUMMARY OF THE INVENTION

In one aspect, the invention is a composite prepared using athermosettable epoxy resin composition having, as formulationcomponents: (1) an epoxy resin; (2) an epoxidized cycloaliphaticdicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-Anovolac resin; (4) an optional oligomeric butadiene; (5) an optionalorganic solvent; and (6) an alkylphenol novolac resin, the alkylphenolnovolac resin serving as a curing agent, wherein, the formulationcomponents, when cured, have a D_(f) of about 0.023 or less at 1 GHz anda D_(k) of about 3.2 or less at 1 GHz.

In another aspect the invention is a prepreg, or a laminate including aprepreg, prepared using a thermosettable epoxy resin composition having,as formulation components: (1) an epoxy resin; (2) an epoxidizedcycloaliphatic dicyclopentadiene phenolic resin; (3) an optionalepoxidized bisphenol-A novolac resin; (4) an optional oligomericbutadiene; (5) an optional organic solvent; and (6) an alkylphenolnovolac resin, the alkylphenol novolac resin serving as a curing agentwherein, the formulation components, when cured, have a D_(f) of about0.023 or less at 1 GHz and a D_(k) of about 3.2 or less at 1 GHz.

BRIEF DESCRIPTIONS OF THE DRAWINGS

The advantages and further aspects of the disclosure will be readilyappreciated by those of ordinary skill in the art as the same becomesbetter understood by reference to the following detailed descriptionwhen considered in conjunction with the accompanying figures:

FIG. 1 is a plot of dielectric constant as a function of frequency forExamples 1 and 2;

FIG. 2 is a plot of dissipation as a function of frequency for Examples1 and 2;

FIG. 3 is a photograph of the surface of a prepreg made using Example 2;

FIG. 4 is a photograph of the surface of a prepreg made using Example10;

FIG. 5 is a plot of dielectric constant as a function of frequency forExample 11;

FIG. 6 is a plot of dissipation as a function of frequency for Example11;

FIG. 7 is a photograph of the surface of a prepreg made using Example12; and

FIG. 8 is a photograph of the surface of a prepreg made using Example14.

DETAILED DESCRIPTION

In the practice of at least one embodiment of the invention, a laminateis prepared using a thermosettable epoxy resin composition having, ascomponents: (1) an epoxy resin; (2) an epoxidized cycloaliphaticdicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-Anovolac resin; (4) an optional oligomeric butadiene; (5) an optionalorganic solvent; and (6) an alkylphenol novolac resin, the alkylphenolnovolac serving as a curing agent.

Epoxy Resin Component

Epoxy resins are those resins containing at least one vicinal epoxygroup. The epoxy resins useful as components of the thermosettable epoxyresin composition of the disclosure may be saturated or unsaturated,aliphatic, cycloaliphatic, aromatic or heterocyclic, and may besubstituted with alkyl and other moieties. The epoxy resin component mayalso be monomeric or polymeric.

The epoxy resin component utilized may be, for example, an epoxy resinor a combination of epoxy resins prepared from an epihalohydrin and aphenol or a phenol type compound, prepared from an epihalohydrin and anamine, prepared from an epihalohydrin and an a carboxylic acid, orprepared from the oxidation of unsaturated compounds.

In one embodiment, the epoxy resins utilized in the compositions of theapplication include those resins produced from an epihalohydrin and aphenol or a phenol type compound. The phenol type compounds includecompounds having an average of more than one aromatic hydroxyl group permolecule. Examples of phenol type compounds include, but are not limitedto dihydroxy phenols, biphenols, bisphenols, halogenated biphenols,halogenated bisphenols, hydrogenated bisphenols, alkylated biphenols,alkylated bisphenols, trisphenols, phenol-aldehyde resins, novolacresins, the reaction product of phenols and simple aldehydes, preferablyformaldehyde), halogenated phenol-aldehyde novolac resins, substitutedphenol-aldehyde novolac resins, phenol-hydrocarbon resins, substitutedphenol-hydrocarbon resins, phenol-hydroxybenzaldehyde resins, alkylatedphenol-hydroxybenzaldehyde resins, hydrocarbon-phenol resins,hydrocarbon-halogenated phenol resins, hydrocarbon-alkylated phenolresins or combinations thereof.

In another embodiment, the epoxy resin components utilized in thecompositions of the disclosure may desirably include those resinsproduced from an epihalohydrin and bisphenols, halogenated bisphenols,hydrogenated bisphenols, novolac resins, and polyalkylene glycols orcombinations thereof.

In still another embodiment, the epoxy resin components utilized in thethermosettable epoxy resin compositions of the disclosure may includethose resins produced from an epihalohydrin and resorcinol, catechol,hydroquinone, biphenol, bisphenol-A, bisphenol-AP(1,1-bis(4-hydroxyphenyl)-1-phenyl ethane), bisphenol bisphenol K,tetrabromobisphenol-A, phenol-formaldehyde novolac resins, alkylsubstituted phenol-formaldehyde resins, phenol-hydroxybenzaldehyderesins, cresol-hydroxybenzaldehyde resins, dicyclopentadiene-phenolresins, dicyclopentadiene-substituted phenol resins tetramethylbiphenol,tetramethyl-tetrabromobiphenol, tetramethyltribromobiphenol,tetrachlorobisphenol-A, or combinations thereof.

In an embodiment that may have fire retardant properties, the epoxyresin component may include a halogenated epoxy resin, an in-situhalogenated epoxy resin or a combination thereof. In some embodiments,the halogen is desirably bromine. In-situ bromination may be performed,for example, utilizing in combination an epoxy resin and a brominatedphenol, such as, for example, tetrabrominated bisphenol-A (TBBPA). Theamount of bromine in the system may be adjusted such that the total burntime of a laminate produced, as measured by Underwriter Laboratoriestest UL94, is between about 2 to about 50 seconds, in some embodiments,the total burn time is from about 10 to about 50 seconds and in otherembodiments, from about 15 to about 30 seconds. All individual UL94 testspecimen burn times were less than 10 seconds. The epoxy resin componentmay include a resin prepared from an epihalohydrin and a phenol or aphenol type compound utilized in combination with a brominated epoxyresins or an in-situ brominated epoxy resin.

In another embodiment, the epoxy resin component includes a mixture ofan epoxy resin and a flame retarded additive and phenolic hydroxylgroups. The flame retardant additive may or may not contain a halogen.Suitable examples of halogenated flame retardant additives include, butare not limited to, tetrabromobisphenol-A (TBBPA), epoxidized TBBPA andits oligomers (EPON Resin 1163), tetrachlorobisphenol-A (TCBPA),epoxidized TCBPA and its oligomers, brominated and chlorinated novolacs,bromophenol & chlorophenol, dibromophenol & dichlorophenol,2,4,6-Tribromophenol and 2,4,6-Trichlorophenol, halogenated β-lactones,chlorendic anhydride[1,4,5,6,7,7-hexachlorobicyclo[2.2.1]-5-heptane-2,3-dicarboxylic acid],chlorinated waxes, tetrabromophthalic anhydride, oligomeric brominatedpolycarbonates and combinations thereof.

Suitable examples of non-halogenated flame retardant additives include,but are not limited to aluminum oxide hydrates, aluminum carbonates,magnesium hydroxides, vitrifying borates and phosphates, redphosphorous, phosphoric acid esters, phosphonic acid esters, phosphines,phosphinates, phosphonates, melamine resins (melamine cyanurates andmelamine cyanurates), triphenyl phosphates diphenyl phosphates,polyamine1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxohexahydrotriazine, epoxygroup containing glycidyl phosphate or glycidyl phosphinate,dihydro-9-oxa-10-phosphapheneantrene-10-oxide and its epoxidizedvariants, antimony trioxide, zinc borate and combinations thereof.

In another embodiment, the epoxy resin components utilized in thethermosettable epoxy resin composition of the present applicationinclude those resins produced from an epihalohydrin and an amine.Suitable amines may include diamino diphenylmethane, aminophenol, xylenediamine, anilines, and the like, or combinations thereof. In anotherembodiment, the epoxy resins utilized in the embodiments of thedisclosure include those resins produced from an epihalohydrin and acarboxylic acid. Suitable carboxylic acids may include phthalic acid,isophthalic acid, terephthalic acid, tetrahydro- and/orhexahydrophthalic acid, endomethylene tetrahydrophthalic acid,isophthalic acid, methyl hexahydrophthalic acid, and the like orcombinations thereof.

In another embodiment, the epoxy resin components utilized include thoseresins produced from an epihalohydrin and compounds having at least onealiphatic hydroxyl group. In this embodiment, it is understood that suchresin compositions produced contain an average of more than onealiphatic hydroxyl groups. Examples of compounds having at least onealiphatic hydroxyl group per molecule include aliphatic alcohols,aliphatic diols, polyether diols, polyether triols, polyether tetrols,any combination thereof and the like. Also suitable are the alkyleneoxide adducts of compounds containing at least one aromatic hydroxylgroup. In this embodiment, it is understood that such resin compositionsproduced contain an average of more than one aromatic hydroxyl groups.Examples of oxide adducts of compounds containing at least one aromatichydroxyl group per molecule may include, bat are not limited to,ethylene oxide, propylene oxide, or butylene oxide adducts of dihydroxyphenols, biphenols, biphenols, halogenated bisphenols, alkylatedbiphenols, trisphenols, phenol-aldehyde novolac resins, halogenatedphenol-aldehyde novolac resins, alkylated phenol-aldehyde novolacresins, hydrocarbon-phenol resins, hydrocarbon-halogenated phenolresins, or hydrocarbon-alkylated phenol resins, or combinations thereof.

In another embodiment the epoxy resin component may be an advanced epoxyresin which is the reaction product of one or more epoxy resinscomponents, as described above, with one or more phenol type compoundsand/or one or more compounds having an average of more than onealiphatic hydroxyl group per molecule as described above. Alternatively,the epoxy resin may be reacted with a carboxyl substituted hydrocarbon.A carboxyl substituted hydrocarbon which is described herein as acompound having a hydrocarbon backbone, preferably a C₁-C₄₀ hydrocarbonbackbone, and one or more carboxyl moieties, preferably more than one,and most preferably two. The C₁-C₄₀ hydrocarbon backbone may be astraight- or branched-chain alkane or alkene, optionally containingoxygen. Fatty acids and fatty acid dimers are among the usefulcarboxylic acid substituted hydrocarbons. Included in the fatty acidsare caproic acid, caprylic acid, cupric acid, octanoic acid, VERSATIC™acids, available from Hexion Specialty Chemicals, Inc., Houston, Tex.,and decanoic acid, lauric acid, myristic acid, palmitic acid, stearicacid, palmitoleic acid, oleic acid, linoleic acid, linolenic acid,erucic acid, pentadecanoic acid, margaric acid, arachidic acid, anddimers thereof.

In still another embodiment, the epoxy resin component may be thereaction product of a polyepoxide and a compound containing more thanone isocyanate moiety or a polyisocyanate. In some embodiments, theepoxy resin that may be produced in such a reaction is anepoxy-terminated polyoxazolidone.

The epoxy resin component of the composition useful for preparinglaminates is present as a weight percentage (wt %) of all components ofthe composition of from about 30 wt % to about 80 wt % percent, in someembodiments, the epoxy resin component is present as a weight percentageof all components of the composition of from about 50 wt % to about 80wt % and in other embodiments it is present in a range of from about 60wt % to about 80 wt %.

The preparation of epoxy resin compounds is well known in the art.Examples of epoxy resins and their precursors suitable for use in thecompositions of some embodiments of the invention are also described,for example, in U.S. Pat. Nos. 5,137,990 and 6,451,898 which are fullyincorporated herein by reference.

Epoxidized Cycloaliphatic Dicyclopentadiene Phenolic Resin

The second component of the thermosettable epoxy resin compositionuseful for preparing laminates is an epoxidized cycloaliphaticdicyclopentadiene phenolic resin. The epoxidized cycloaliphaticdicyclopentadiene phenolic resins utilized in the compositions mayinclude those resins produced from an epihalohydrin and adicyclopentadiene polyphenolic compound having the general formula:

wherein “n” represents a whole number from 0 to 7; Ph is a phenylolradical derived from mononuclear phenol, and D is a tricyclodecyleneradical having a general formula:

which may be methylated. In some embodiments, n is a whole number offrom 0 to 3.

In at least one embodiment, phenol is used to prepare thetricyclodecylene radical while in others the phenylol radical maycontain other organic constituent groups. The tricyclodecylene radicalmay be prepared by conversion of mono-nuclear phenols which possess atleast one free ortho- and/or para-position relative to a phenolichydroxyl group, with a dicyclopentadiene. Suitable phenols useful forthis may include, for instance, phenol, o-, m-, and p-cresol, 3,4- and3,5-dimethylphenol, the various alkyl phenols with in general not morethan 15 carbon atoms per alkyl group, resorcinol, and mixtures of two ormore phenols such as technical cresol.

in some embodiments, the dicyclopentadiene used to prepare thetricyclodecylene radical may be unsubstituted dicyclopentadiene. Inother embodiments, a dimer of cyclopentadiene or a co-dimer ofcyclopentadiene and methylcyclopentadiene may be so used.

The molar ratio in which the phenol and the dicyclopentadiene are causedto react may be between 1.5:1 and 15:1. In some embodiments of theapplication, the ratio may be between 4:1 and 10:1. Under the latterconditions the value of the number n in the aforementioned formula willusually equal zero.

The preparation of epoxidized cycloaliphatic dicyclopentadiene phenolicresin is well known in the art. Examples of such resins and theirprecursors suitable for use in the compositions of some embodiments ofthe invention are also described, for example, in U.S. Pat. No.3,536,734, which is fully incorporated herein by reference.

The epoxidized cycloaliphatic dicyclopentadiene phenolic resin may bepresent in a range of from about 5 wt % to about 70 wt % as a weightpercentage of all components of the composition. In some embodiments,the epoxidized cycloaliphatic dicyclopentadiene phenolic resin ispresent from about 15 wt % to about weight 60 wt %, and in otherembodiments it is present in a range of from about 20 wt % to about 40wt %, based upon the weight of all components of the composition.

Epoxidized Bisphenol-A Novolac Component

The epoxidized bisphenol-A novolac resin component of the applicationcontains at least three novolac epoxide groups per molecule. Exemplarycompounds include, but are not limited to epoxidized phenolic novolacs,epoxidized o-cresol novolacs, epoxidized bisphenol of acetone novolacsand the like. These epoxy resins may be used alone or in an admixture oftwo or more. This optional component, when present, may be present fromabout 10 wt % to about 40 wt % as a weight percentage of all componentsin the composition. In some embodiments, the epoxidized bisphenol-Anovolac resin component may be present in a range of from about 10 wt %to about 20 wt %.

Oligomeric Butadiene Component

The optional oligomeric butadiene component is a homopolymer ofbutadiene having a molecular weight (Mw) of from about 1,000 to about20,000 Daltons. In some embodiments, this homopolymer will have a 1, 2vinyl group content of at least 25%. In some embodiments, the 1, 2 vinylgroup content may be from 25 to about 99 percent and, in otherembodiments, from about 5 to about 99 percent. The optional homopolymercomponent may be present, if present at all, in the thermosettable epoxyresin composition of the disclosure useful for preparing laminates at aconcentration of from about 0.05 wt % to about 4 wt % as a weightpercentage of all components in the composition. In some embodiment,this range may be from about 0.1 wt % to about 1.5 wt %, and in otherembodiments, the range may be from about 0.2 wt % to about 1.0 wt % as aweight percentage of all components in the composition. Thishomopolymers may be prepared using any method known to be useful tothose of ordinary skill in the art of preparing homopolymers ofbutadiene.

Organic Solvent Component

At least one solvent may optionally be used to prepare thethermosettable epoxy resin composition of the disclosure. In manyembodiments, the solvent will be present at a weight concentration offrom about 15 to about 50 wt % based upon the weight of all formulationcomponents. The solvent or solvents may be present at a concentration offrom about 20 to 40 wt % is some embodiments. Those of ordinary skill inthe art of preparing laminates will well know how to select suitablesolvents and what concentration of solvent to use for their particularapplications.

Suitable solvents useful as the solvent component in some embodiments ofthe disclosure may include ketones, alcohols, glycol ethers, aromatichydrocarbons and mixtures thereof. Other solvents which may be used withthe process of the disclosure include, but are not limited to methylethyl ketone, methyl isobutyl ketone, propylene glycol methyl ether,ethylene glycol methyl ether, methyl amyl ketone, methanol, isopropanol,toluene, xylene, dimethylformamide and the like. A single solvent may beused, but in many embodiments, different solvents may be used for one ormore of the components. For example, suitable solvents for the epoxyresin components may be ketones. Suitable solvents for the curing agentcomponents detailed below may include, for example, ketones, amides suchas dimethylformamide (DMF), ether alcohols such as methyl, ethyl, propylor butyl ethers of ethylene glycol, diethylene glycol, propylene glycolor dipropylene glycol, ethylene glycol monomethyl ether, or1-methoxy-2-propanol.

Alkylphenol Novolac Curing Agent Component

The thermosettable epoxy resin composition of the disclosure may includea substituted novolac curing agent or a blend of differently substitutednovolac curing agents, each represented by the general formula:

where: Ar represents an aryl or alkyl-aryl group; each Ar group containsx number of non-aromatic carbon atoms, OH represents a hydroxyl groupbonded to each Ar group, R¹ represents substituent group(s) bonded toeach Ar group, each R² represents a group connecting adjacent Ar groups,n is a number between 2 and 20, x is an integer from 4 to 8, y is aninteger from 1 to x−2, and z is an integer from 1 to x−3.

In this general formula, each Ar may be the same or different andcontains 5 to 7 carbon atoms and more preferably contains 6 carbonatoms; each R¹ may be the same or different and is an alkyl group oraryl group containing 2 to 20 carbon atoms, more preferably containing 4to 9 carbon atoms and most preferably selected from a butyl, octyl orphenyl group; each R² may be the same or different and is an alkylgroup, more preferably an alkyl group containing 1 to 5 carbon atoms,and most preferably a methyl or ethyl group; n is a number from 2 and 20and preferably from 4 and 20.

In one embodiment, the curing agent may be a substituted novolac curingagent or a blend of differently substituted novolac curing agents eachrepresented by the general formula:

wherein R¹, R² and n are defined as above. And some embodiments, R¹represents a single alkyl substituent in the para position having from 4to 9 carbon atoms and is sometimes a butyl or octyl group. In oneembodiment, R² is desirably in a methyl group.

In another embodiment, the substituted novolac curing agent is selectedfrom octyl-phenol novolac, nonyl-phenol novolac, phenyl phenol novolac,t-butyl-phenol novolac, cardanol novolac, and combinations thereof. In apreferred embodiment the curing agent comprises a combination of octylphenol novolac and butyl novolac.

In another embodiment; the substituted novolac curing agent comprises aco-novolac compound wherein R¹ represents a different alkyl groups onthe same molecule. In this embodiment each R¹ is preferably an alkylgroup, having from 4 to 15 carbon atoms, and is more preferably a butylor octyl group. In a preferred embodiment, the curing agents comprise aco-novolac containing octyl and butyl substituent groups. In stillanother embodiment, the curing agent could comprise a co-novolaccontaining either phenol or bisphenol-A and an alkyl phenol.

In another embodiment, and in addition to the above, the substitutednovolac curing agent comprises a compound wherein the weight averagemolecular weight (Mw) of the substituted novolac curing agent is lessthan 4000, sometimes less than 3000 and in other embodiments betweenabout 1000 and 4000, sometimes between about 1500 and 3000, andsometimes between about 1600 to 2700.

In yet another embodiment, the substituted novolac curing agent of theinvention is utilized in combination with other curing agents known inthe art such as for example, with unsubstituted phenol curing agents, oran amine- or amide-containing curing agent. Suitable unsubstitutedphenol curing agents may include dihydroxy phenols, biphenols,bisphenols, halogenated biphenols, halogenated bisphenols, hydrogenatedbisphenols, trisphenols, phenol-aldehyde resins, phenol-aldehyde novolacresins, halogenated phenol-aldehyde novolac resins, phenol-hydrocarbonresins, phenol-hydroxybenzaldehyde resins, alkylatedphenol-hydroxybenzaldehyde resins, hydrocarbon-phenol resins,hydrocarbon-halogenated phenol resins, or combinations thereof. In someembodiments, the unsubstituted phenolic curing agent includesunsubstituted phenols, biphenols, bisphenols, novolacs or combinationsthereof.

The ratio of curing agent to epoxy resin may be suitable to provide afully cured resin. The amount of curing agent which may be present mayvary depending upon the particular curing agent used (due to the curechemistry and curing agent equivalent weight as is well known in theart). In one embodiment, the ratio of total epoxy groups to the phenolichydroxyl equivalents may be between about 0.5 to about 1.5, sometimesbetween about 0.6 to about 1.2, and sometimes between about 0.8 to about1.0.

Accelerator Component

Optional accelerators useful in the compositions of the inventioninclude those compounds which catalyze the reaction of the epoxy resinwith the curing agent.

In one embodiment, the accelerators are compounds containing amine,phosphine, heterocyclic nitrogen, ammonium, phosphonium, arsonium orsulfonium moieties. More preferably, the accelerators are heterocyclicnitrogen and amine-containing compounds and even more preferably, theaccelerators are heterocyclic nitrogen-containing compounds.

In another embodiment, the heterocyclic nitrogen-containing compoundsuseful as accelerators include heterocyclic secondary and tertiaryamines or nitrogen-containing compounds such as, for example,imidazoles, imidazolidines, imidazolines, bicyclic amidines, oxazoles,thiazoles, pyridines, pyrazines, morpholines, pyridazines, pyrimidines,pyrrolidines, pyrazoles, quinoxalines, quinazolines, phthalazines,quinolines, purines, indazoles, indazolines, phenazines, phenarsazines,phenothiazines, pyrrolines, indolines, piperidines, piperazines, as wellas quaternary ammonium, phosphonium, arsonium or stibonium, tertiarysulfonium, secondary iodonium, and other related “onium” salts or bases,tertiary phosphines, amine oxides, and combinations thereof. Imidazolesas utilized herein include imidazole, 1-methylimidazole,2-methylimidazole, 4-methylimidazole, 2-ethylimidazole,2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole,1-benzyl-2-methylimidazole, 2-heptadecyl imidazole,4,5-diphenylimidazole, 2-isopropylimidazole, 2,4-dimethyl imidazole,2-phenyl-4-ethylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole andthe like. Preferred imidazoles include 2-methylimidazole,2-phenylimidazole and 2-ethyl-4-methylimidazole.

Imidazolines as utilized herein include 2-methyl-2-imidazoline,2-phenyl-2-imidazoline, 2-undecylimidazoline, 2-heptadecylimidazoline,2-isopropylimidazole, 2,4-dimethyl imidazoline,2-phenyl-4-methylimidazoline, 2-ethylimidazoline,2-isopropylimidazoline, 4,4-dimethyl-2-imidazoline,2-benzyl-2-imidazoline, 2-phenyl-4-methylimidazoline and the like.

Among preferred tertiary amines that may be used as accelerators arethose mono- or polyamines having an open chain or cyclic structure whichhave all of the amine hydrogen replaced by suitable substituents, suchas hydrocarbon radicals, and preferably aliphatic, cycloaliphatic oraromatic radicals. Examples of these amines include, among others,methyl diethanolamine, triethylamine, tributylamine,benzyl-dimethylamine, tricyclohexyl amine, pyridine, quinoline, and thelike. Preferred amines are the trialkyl and tricycloalkyl amines, suchas triethylamine, tri(2,3-dimethylcyclohexyl)amine, and the alkyldialkanol amines, such as methyl diethanolamine and the trialkanolaminessuch as triethanolamine. Weak tertiary amines, e.g., amines that inaqueous solutions give a pH less than 10, are particularly preferred.Especially preferred tertiary amine accelerators are benzyldimethylamineand tris-(dimethylaminomethyl)phenol.

The amount of accelerator present may vary depending upon the particularcuring agent used (due to the cure chemistry and curing agent equivalentweight as is known in the art).

Use in Laminates

Laminates may be prepared using the thermosettable epoxy resincompositions of the disclosure by contacting the compositions withporous substrates. The contacting may be performed using any methodknown to those skilled in the art. Examples of such contacting methodsinclude powder coating, spray coating, die coating, coating andcontacting the laminate substrate with a bath containing thecomposition, in one embodiment, the article is contacted with thecomposition in a bath.

The epoxy resin compositions described herein may be most commonly foundin solution or dispersion, in those embodiments where the variouscompositions are in solution or dispersion, the various components ofthe composition may be dissolved or dispersed in the same solvent or maybe separately dissolved in a solvent suitable for that component, thenthe various solutions are combined and mixed. Sometimes, when the epoxyresin composition is in the form of a solution or dispersion, it isreferred to as a varnish.

The epoxy resin compositions described herein may optionally contain oneor more known fillers in an amount sufficient to provide for enhancedflammability, lowered coefficient of thermal expansion or improvedthermal decomposition. The selection and nature of the fillers will varydepending upon the composition formulations as is known in the art. Byway of example, such fillers include, but are not limited to, aerogels,alumina, calcium carbonate, clay, crystalline silica, fumed silica,fused silica, glass microspheres (hollow or solid), hydrogels, lyogels,mica, organogels, polymeric microspheres (hollow or solid), spodumene,talc, and the like, including any combination or subset thereof. Thefillers, if utilized, are typically present in an amount of betweenabout 5 wt % to about 30 wt %, based upon the weight of all componentsof the composition, and can vary in mean particle size from about 1 toabout 15 microns. Also, by way of example, the filler may be pre-treatedprior to their addition to the composition with additives such asadhesion promoters, stabilizers, thickeners and the like as is known inthe art. Further, the filler may be utilized in the compositions inconjunction with dispersing or stabilizing agents to maintain a uniformsuspension as is known to those skilled in the art.

Laminates, especially printed circuit boards, are required to have goodphysical properties, while simultaneously having good electricalinsulating performance, especially at frequencies of around or above oneGHz. Laminates prepared with conventional epoxy resin compositions oftendo not meet the newer, more stringent, specifications of modernmanufacturers. An advantage of the laminates of the disclosure is thatthey may have balanced properties. That is, they may have the samephysical properties as conventional laminates while having betterelectrical insulating properties.

Printed circuit boards prepared using epoxy resin compositions of thedisclosure, have superior electrical performance, when compared toprinted circuit boards and using conventional epoxy resin compositions.The physical properties of printed circuit boards of the disclosure areabout as good as or even better than conventional printed circuitboards. The balanced properties of the laminates of the disclosure maybe advantageous in electrical applications.

Another advantage of laminates prepared using the epoxy resincompositions of the disclosure is that they, in some applications, mayhave a very smooth appearance. While not wishing to be bound by anytheory, it is believed that the oligomeric butadiene component of theepoxy resin compositions of the disclosure is responsible for theimprovement. Especially in applications, where there is the possibledevelopment of rough surfaces during the prepreg processing, it may bedesirable to prepare the laminates with formulations including theoptional oligomeric butadiene component.

In addition to high-performance electrical laminates, the resincompositions of the disclosure may find utility in, for example, moldingpowders, coatings, and structural composite parts fabrication.

In order to provide a better understanding of the present inventionincluding representative advantages thereof, the following examples areoffered. However, this invention is by no means limited by theseexamples.

EXAMPLES

The examples and comparative examples were prepared and tested using themethods shown below.

Dielectric Constant (D_(k))

For frequencies at or below 10 megahertz (MHz), this measurement wasconducted per ASTM (American Society for Testing and Materials) D150,“Standard Test Method for A-C Loss Characteristics and Permittivity(Dielectric Constant) of Solid Electrical insulating Materials”. Aparallel-plate fixture having a 1.5 inch diameter guided electrode wasutilized to conduct these tests. For frequencies above 10 MHz, thismeasurement was conducted per ASTM D2520, “Standard Test Methods forComplex Permittivity (Dielectric Constant) of Solids ElectricalInsulating Materials at Microwave Frequencies and Temperatures to 1650Degrees C”. Method B, Resonant Cavity Perturbation Technique, was used.The electrical field inside the cavities was parallel to the length ofthe test samples. The precision of the results was typically +/−1%. Inone embodiment, the D_(k) of the fully cured resin formulationcomponents of the invention as determined in accordance with ASTM D150,at 1 GHz is less than 3.2. In another embodiment, the D_(k) of the fullycured resin formulation components of the invention as determined inaccordance with ASTM D150, at 1 GHz is less than 3.0.

Dissipation Factor (D_(r))

For frequencies at or below 10 megahertz (MHz), this measurement wasconducted per ASTM D150, “Standard Test Method for A-C LossCharacteristics and Permittivity (Dielectric Constant) of SolidElectrical Insulating Materials”. A parallel-plate fixture having a 1.5inch diameter guided electrode was utilized to conduct these tests. Forfrequencies above 10 MHz, this measurement was conducted per ASTM D2520,“Standard Test Methods for Complex Permittivity (Dielectric Constant) ofSolids Electrical Insulating Materials at Microwave Frequencies andTemperatures to 1650 Degrees C”. Method B, Resonant Cavity PerturbationTechnique, was used. The electrical field inside the cavities wasparallel to the length of the test samples. The precision of the resultswas typically +/−2 to 3%. In one embodiment, the D_(f) of the fullycured resin formulation components of the invention is about 0.023 orless at 1 GHz. In another embodiment, the D_(f) of the fully cured resinformulation components of the invention is less than 0.015 at 1 GHz.

Glass Transition Temperature

The Glass Transition Temperature (T_(g)) of the resin in the laminateswas measured by Differential Scanning calorimetry (DSC) at a heat-uprate of 20° C./minute from 50° C. to 220° C. followed by rapid coolingand a second identical heating rate scan. The Temperature of the DSC wascalibrated using an indium and a Tin standard. The DSC instrument was aPerkin Elmer DSC Model 7. In one embodiment, the T_(g) of the fullycured resin formulation components of the invention is greater than 150°C. In another embodiment, the T_(g) of the fully cured resin formulationcomponents of the invention is greater than 170° C.

Thermal Decomposition Temperature

The Thermal Decomposition Temperature (Td) of the resin in the laminateswas measured using thermogravimetric analysis as described in IPC(Institute for Interconnecting and Packaging Electronic Circuits) TestMethod IPC-TM-650 2.4.24.6. In one embodiment, the Td of the fully curedresin formulation components of the invention is greater than 300° C.

Weight Per Epoxide

The Weight per Epoxide (WPE & also known as the epoxy equivalent weight,EEW) was measured using an industry standard perchloric acid titrationmethod.

Molecular Weight Via Gel Permeation Chromatography

The Weight Average Molecular Weight (Mw) herein is measured using sizeexclusion gel permeation chromatography (GPC) which was calibrated usingpolystyrene molecular weight standards. A sample is dissolved intetrahydrofuran and the resulting solution is run through a HewlettPackard model 1100HPLC.

Prepreg Dust Gel Time

Approximately 0.2 grams of prepreg dust is placed upon the preheated(348° F.) surface of a hot plate that had been treated with a moldrelease agent, After 10 seconds, to allow the prepreg dust to melt, themixture was repeatedly stroked to the left and to the right using a 0.5inch wide preheated stainless steel spatula having a wooden handle. Withtime, the mixture begins to polymerize and becomes a viscous stringymass. Eventually, these strings no longer form between the gel plate andthe spatula during the stroking process. The time from when the samplewas placed upon the gel plate unto when this stringing ceases isconsidered as the Prepreg Dust Gel Time and it is recorded in seconds.This test was conducted in duplicate.

Prepreg Volatile Content

A 10.2 cm×10.2 cm piece of prepreg is conditioned at 50% RelativeHumidity and 25° C. for four hours. It is then weighed to the nearestmilligram (W1), The prepreg is hung from a metal hook in a preheatedoven at 163° C. for 15 minutes. It is then allowed to cool in adesiccator. The prepreg is then weighed to the nearest milligram (W2).The volatile content of the prepreg is calculated as follows:Volatile Content, wt %=((W1−W2)×100)/W1

Resin Content The Resin Content of the prepreg was measured using theprocedures in IPC Test Method IPC-TM-650 2.3.16.2, “Treated Weight ofPrepreg”.

Resin Flow

The Resin Flow of the prepreg was measured using the procedures in IPCTest Method IPC-TM-650 2.3.17, “Resin Flow Percent of Prepreg”.

Varnish Gel Time

Three milliliters of an epoxy varnish formulation were placed on thesurface of a preheated (348° F.) hot plate that had been treated with amold release agent. After 15 seconds, to allow the majority of theorganic solvent(s) to evaporate, the mixture was repeatedly stroked tothe left and to the right using a 0.5 inch wide preheated stainlesssteel spatula having a wooden handle. With time, the mixture begins topolymerize and becomes a viscous stringy mass. Eventually, these stringsno longer form between the gel plate and the spatula during the strokingprocess. The time from when the sample was placed upon the gel plateunto when this stringing ceases is considered as the Varnish Gel Timeand it is recorded in seconds.

Comparative Example 1 Conventional Lead-Free High T_(g) Laminating Resin

This example provides a typical resin formulation; Prepreggingcharacteristics; and, laminate and neat resin properties for astate-of-the-art, lead-free solder processable, high Glass TransitionTemperature (T_(g)) epoxy laminating resin. It is presented as the basisfor comparison with the proposed formulation improvements provided inthis patent.

A varnish composition was prepared using art epoxidized phenolic Novolacresin dissolved in Acetone (having a WPE of 176 to 181 available fromHexion Specialty Chemicals as EPON Resin 154-A-80. This solution was 80(N) by weight EPON Resin 154 and 20% by weight Acetone.), an epoxidizedmultifunctional resin (having a WPE of 200 to 240 available from flexionSpecialty Chemicals as EPON Resin 1031), and a Diglycidyl ether fromepichlorohydrin and Tetrabromobisphenol of Acetone (having a WPE from380 to 410 and containing 50 wt % Bromine available from flexionSpecialty Chemicals as EPON Resin 1163). To this resin mixture was addeda phenolic Novolac (with a Weight Average Molecular Weight, Mw of 1610,as measured using Gel Permeation Chromatography (GPC), and residualmonomer content of less than 0.2 wt %) available from Flexion SpecialtyChemicals as SD-1702. The phenolic Novolac was allowed to completelydissolve, at ambient temperature with mechanical agitation, into theresin solution. A solution of 10 wt % 2-Methylimidazole (2MI) and 90 wt% 1-Methoxy-2-propanol (Propylene Glycol Monomethyl Ether, PGME) wasthen added into the previously made resin solution. 2MI is a curingaccelerator for the epoxide-phenolic reaction of the formulations usedin these examples, The Gel time of this reactive varnish was 191 secondsat 171° C.

This varnish was used to impregnate 33 cm×33 cm pieces of woven glasscloth (glass cloth style 7628 with glass binder type 643 available fromBGF Industries Inc.). This material is an industrial grade fiberglasscloth commonly utilized in the electrical laminating industry.

A pre-measured quantity of the varnish solution was applied to thefiberglass cloth manually and the varnish was uniformly distributed andworked into the fiberglass cloth using a paintbrush. The resultingvarnish impregnated fiberglass cloth was hung in an air-circulating ovenat 165° C. to remove its volatile solvents and to partially cure thevarnish's reactive components. Each sheet of prepreg was kept in theair-circulating oven for typically 3.75 minutes. This laboratory prepregpreparation process emulates the commercial manufacturing of industrialelectrical laminating prepregs.

The surface appearance of this laboratory prepared prepreg was visuallyjudged to be excellent. It was transparent, shiny and contained nosurface defects such as craters, pinholes, “orange peel” or resin sags.The resin content of these prepregs was between 41 and 44 wt % (forthose used in making laminates) and between 45 and 50 wt % (for thoseused in making prepreg dust for neat castings). The volatile content ofboth types of prepregs were less than 0.2 wt %. The prepregs that wereused for preparing resin dust, as described in the following paragraph,had oven times greater than 3.75 minutes to provide for enhanced resinflow that is required to yield void free resin castings.

After allowing the prepreg to cool to room temperature, the partiallycured resin in the prepreg sheets with high resin content was subjectedto mechanical abrasion to physically remove it from the fiberglasscloth. Any remaining glass fibers in this prepreg dust were thenseparated from the partially cured resin dust. A selected amount of thisprepreg dust was placed into a rectangular cavity mold and it wasinserted between temperature controlled platens of a laboratory press(Tetrahedron Associates, Incorporated, model 1402). The polymerizationof the neat resin prepreg dust was completed using the following curecycle:

-   -   (1) apply 0.64 MPa pressure to the mold;    -   (2) increase the temperature of the mold from room temperature        to 182.2° C. at 11.1° C. per minute; upon reaching 193.3° C.,        hold at this temperature for 1.5 hours;    -   (3) cool under pressure from 193.3° C. to 40.6° C. at 5.6° C.        per minute; and    -   (4) release the pressure and remove the cured neat resin casting        from the mold.

Fiberglass laminates were also made from this prepreg, curing them in asimilar manner, by placing an eight ply stack of these prepregs betweenthe temperature controlled platens of this press. However, the heat-uprate used for curing laminates was 5.6° C. per minute in step 1 of theabove curing cycle and its cool-down rate was 11.1° C. per minute instep 2 above.

The composition of this formulation, its prepreg characteristics andlaminate properties can be found in Table 1. The dielectric constant anddissipation of this resin's neat casting was measured at roomtemperature using the methods described earlier in this section. Thesemeasured values can be found in Table 2 and FIGS. 1 and 2 (solidcircles).

This example provides a representative illustration of the currentstate-of-the-art, lead-free, high T_(g) epoxy laminating resin.

Example 2 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using a Medium Molecular Weight Epoxidized DCPDPhenol Novolac

The varnish composition of Example 2 was prepared from its componentsaccording to Table 1 and the procedures described in Example 1. Thisvarnish was prepared using an Epoxidized Dicyclopentadiene (DCPD) Phenolresin that had a WPE of 278 and a weight average molecular weight, Mw,of 1040; EPON Resin 1031; and, EPON Resin 1163 was then also added andall were dissolved in Methyl Ethyl Ketone (MEK) at room temperature. Tothis homogenous epoxy resin solution was added, with stirring at roomtemperature, 4-(1,1,3,3-tetramethylbutyl)phenol Novolac [commonlydesignated as Octylphenol Novolac] curing agent that had a Phenolicequivalent weight of 215, a molecular weight, Mw, of 1715 and a residual4-(1,1,3,3-tetramethylbutyl)phenol content of less than 0.4 wt %.Additionally, a high boiling solvent, PGME, was added concurrently. TheNovolac was allowed to completely dissolve into the resin solution. A10% 2MI/90% PGME solution (to function as a curing accelerator) was thenadded to the varnish solution with stirring. The gel time of theresulting varnish solution was 213 seconds at 171° C. As described inExample 1, this varnish solution was then used to impregnate fiberglasscloth. Each sheet of this prepreg was placed in an air-circulating ovenfor 4.5 minutes. The surface appearance of the resulting prepregs wasjudged to be fair/marginal containing some craters and some surfaceroughness. FIG. 3 illustrates the surface appearance of a typical areaof this prepreg. Note that this example was prepared using no oligomericpolybutadiene and thus has a rough surface appearance. A laminate wasthen prepared from these prepregs and its properties can be found inTable 1. These prepregs were observed to be more latent in reactivity,with a resulting increase in their ease of processability, as comparedwith conventional Novolac cured, Lead-Free solder processable, highT_(g) electrical laminating resins.

A cured neat resin casting was prepared from resin dust removed fromsome of these prepregs and its dielectric constant and dissipation wasmeasured. These measured values can be found in Table 2 and FIGS. 1 and2 (solid squares).

This example illustrates the use of a medium molecular weight epoxidizedDCPD Phenol Novolac in the preparation of an epoxy resin composition forimproved Lead-Free solder processable, high T_(g) electrical laminatingresin applications. Its electrical properties (D_(k) and D_(f)) aresuperior to those of the Comparative Example 1 while retaining eithersimilar or improved processing and laminate properties.

Example 3 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using a Low Molecular Weight Epoxidized DCPDPhenol Novolac

This example illustrates an improved electrical performance Lead-FreeSolder processable, high T_(g) epoxy laminating resin composed, in part,of a low molecular weight epoxidized DCPD Phenol Novolac polymerizedusing an Octylphenol Novolac curing agent.

A similar varnish formulation as in Example 1 was prepared, using adifferent epoxidized.

DCPD Phenol Novolac with a WPE of 262 and a Mw value of 523, from itscomponents according to Table 1 and the procedures described in Examples1 and 2. The gel time of this formulation's varnish solution was 204seconds at 171° C. As described in Examples 1 and 2, this varnishsolution was used to impregnate fiberglass cloth. Each sheet of theresulting prepreg was kept in an air circulating oven for 5.25 minutes.The surface appearance of this prepreg was judged to be fair containinga few craters and a very slight “orange peel”. A laminate was thenprepared from this prepreg and its properties can be found in Table 1.

This example illustrates the use of a low molecular weight epoxidizedDCPD Phenol in the preparation of an epoxy resin composition forimproved Lead-Free solder processable, high T_(g) electrical laminatingresin applications. Its properties are similar or superior to thoseprovided in Comparative Example 1.

Example 4 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using a High Molecular Weight Epoxidized DCPDPhenol Novolac

This example illustrates an improved electrical performance Lead-FreeSolder processable, high T_(g) epoxy laminating resin composed, in part,of a high molecular weight epoxidized DCPD Phenol Novolac polymerizedusing an Octylphenol Novolac curing agent.

A similar varnish formulation as in Example 2 was prepared, usinganother different epoxidized DCPD Phenol Novolac with a WPE of 27$ and aMw value of 1420, from its components according to Table 1 and theprocedures described in Examples 1 and 2. The gel time of thisformulation's varnish solution was 209 seconds at 171° C. As describedin Examples 1 and 2, this varnish solution was used to impregnatefiberglass cloth. Each sheet of the resulting prepreg was kept in an aircirculating oven for 5.50 minutes. The surface appearance of thisprepreg was judged to be marginal containing many craters and “orangepeel”. A laminate was then prepared from this prepreg and its propertiescan be found in Table 1.

This example illustrates the use of a high molecular weight epoxidizedDCPD Phenol in the preparation of an epoxy resin composition forimproved Lead-Free solder processable, high T_(g) electrical laminatingresin applications. Its properties are similar or superior to thoseprovided in Comparative Example 1.

TABLE 1 Results for Comparative Example 1 Along with Examples Formulatedusing Varying Molecular Weight Epoxidized DCPD Phenol Novolacs, EPONResin 1163, EPON Resin 1031 and an Octylphenol Novolac Curing AgentExample Number 1 2 3 4 Epoxidized DCPD Phenol Novolac Mw — 1040 523 1420WPE — 272 262 278 Composition, parts (grams) EPON Resin 1163 30.80 28.3428.00 28.34 EPON Resin 1031 10.22 3.26 3.00 3.25 EPON Resin 154-A-8038.51 — — — Epoxidized DCPD — 28.54 26.71 28.54 Phenol Novolac ResinPhenolic Novolac 28.17 — — — (Mw = 1540) Octylphenol Novolac — 39.8642.29 39.88 (Mw = 1715) MEK — 22.93 26.33 21.47 Acetone 20.85 16.7712.49 22.76 PGME 12.21 7.26 7.31 7.26 10% 2MI/90% PGME 0.5 5.82 5.615.33 Prepreg Characteristics Varnish Gel Time 191 204 213 209 (seconds)Oven Time (minutes) 3.75 5.25 4.50 5.50 Prepreg Appearance excellentfair/marginal fair marginal Laminates Characteristics T_(g) (DSC, 2ndHeat) 157 183 173 176

TABLE 2 A Comparison of the Dielectric Constant and Dissipation of NeatResin Castings for Comparative Example 1 and Example 2 as Function ofFrequency Example Number Frequency 1 2 (Hertz) D_(k) D_(f) D_(k) D_(f)100 3.98 0.0042 3.36 0.00180 1000 3.97 0.0061 3.36 0.00294 10000 3.920.0139 3.34 0.0069 100000 3.85 0.0248 3.33 0.0149 1000000 3.67 0.03153.22 0.0191 10000000 3.50 0.0347 3.12 0.0212 350000000 3.28 0.0293 3.000.0193 600000000 3.26 0.0294 2.98 0.0198 1000000000 3.24 0.0289 2.950.0230 2500000000 3.17 0.0290 2.95 0.0216 5000000000 3.17 0.0304 2.950.0235

Example 5 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using Epoxidized DCPD Phenol Novolac and a LowMolecular Weight Octylphenol Novolac Curing Agent

This example illustrates an improved electrical performance Lead-FreeSolder processable, high T_(g) epoxy laminating resin composed, in part,of an epoxidized DCPD Phenol Novolac polymerized using a low molecularweight Octylphenol Novolac curing agent.

An identical varnish formulation as in Example 2 was prepared, using adifferent Octylphenol Novolac with a Mw value of 980, from itscomponents according to Table 3 and the procedures described in Examples1 and 2. The gel time of this varnish solution was 210 seconds at 171°C. As described in Examples 1 and 2, this varnish solution was used toimpregnate fiberglass cloth. Each sheet of the resulting prepreg waskept in an air circulating oven for 5.50 minutes. The surface appearanceof this prepreg was judged to be fair/marginal containing some cratersand “orange peel”. A laminate was then prepared from this prepreg andits properties can be found in Table 3.

This example illustrates the use of a low molecular weight OctylphenolNovolac curing agent in the preparation of an epoxy resin compositionfor Lead-Free solder processable, high T_(g) electrical laminating resinapplications. Its properties are similar or superior to those providedin Comparative Example 1.

Example 6 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using Epoxidized DCPD Phenol Novolac and a HighMolecular Weight Octylphenol Novolac Curing Agent

This example illustrates an improved electrical performance Lead-FreeSolder processable, high T_(g) epoxy laminating resin composed, in part,of an epoxidized DCPD Phenol Novolac polymerized using a high molecularweight Octylphenol Novolac curing agent.

An identical varnish formulation as in Example 2 was prepared, using adifferent Octylphenol Novolac with a Mw value of 2339, from itscomponents according to Table 2 and the procedures described in Examples1 and 2. The gel time of this varnish solution was 175 seconds at 171°C. As described in Examples 1 and 2, this varnish solution was used toimpregnate fiberglass cloth. Each sheet of the resulting prepreg waskept in an air circulating oven for 2.75 minutes. The surface appearanceof this prepreg was judged to be poor/marginal containing many cratersand “orange peel”. A laminate was then prepared from this prepreg andits properties can be found in Table 3.

This example illustrates the use of a high molecular weight OctylphenolNovolac curing agent in the preparation of an epoxy resin compositionfor improved Lead-Free solder processable, high T_(g) electricallaminating resin applications. Its properties are similar or superior tothose provided in Comparative Example 1.

TABLE 3 Results for Comparative Example 1 Along with Examples Formulatedusing Varying Molecular Weight Octylphenol Novolac Curing Agent,Epoxidized DCPD Phenol Novolac, EPON Resin 1163 and EPON Resin 1031Example Number 1 2 5 6 Octylphenol Novolac Mw — 1715 980 2339Composition, parts (grams) EPON Resin 1163 30.80 28.34 28.33 28.34 EPONResin 1031 10.22 3.26 3.27 3.25 EPON Resin 154-A-80 38.51 — — —Epoxidized DCPD — 28.54 28.52 28.53 Phenol Novolac Resin (Mw = 1040)Phenolic Novolac 28.17 — — — (Mw = 1540) Octylphenol Novolac — 39.8639.88 39.87 MEK — 22.93 22.83 22.85 Acetone 20.85 16.77 16.77 16.78 PGME12.21 7.26 7.26 7.27 10% 2MI/90% PGME 0.5 5.82 5.33 5.33 PrepregCharacteristics Varnish Gel Time 191 204 210 175 (seconds) Oven Time(minutes) 3.75 5.25 5.50 2.75 Prepreg Appearance excellent marginalfair/ poor/ marginal marginal Laminates Characteristics T_(g) (DSC, 2ndHeat) 157 183 163 166

Example 7 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using Epoxidized DCPD Phenol Novolac and aPara-Tertiary-Butylphenol Novolac Curing Agent

This example illustrates an improved electrical performance Lead-FreeSolder processable, high T_(g) epoxy laminating resin composed, in part,of an epoxidized DCPD Phenol Novolac polymerized using aPara-tertiary-Butylphenol Novolac curing agent.

An identical varnish formulation as in Example 2 was prepared, using aPara-tertiary-Butylphenol Novolac with a Mw value of 1134, from itscomponents according to Table 2 and the procedures described in Examples1 and 2. The gel time of this formulation's varnish solution was 210seconds at 171° C. As described in Examples 1 and 2, this varnishsolution was used to impregnate fiberglass cloth. Each sheet of theresulting prepreg was kept in an air circulating oven for 5.50 minutes.The surface appearance of this prepreg was judged to be poor/marginalcontaining many craters and “orange peel”. A laminate was then preparedfrom this prepreg and its properties can be found in Table 4.

This example illustrates the use of a Para-tertiary-Butylphenol Novolaccuring agent with an epoxidized DCPD Phenol Novolac in the preparationof an epoxy resin composition for improved Lead-Free solder processable,high T_(g) electrical laminating resin applications, Its properties aresimilar or superior to those provided in Comparative Example 1.

Example 8 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using Epoxidized DCPD Phenol Novolac and aPara-Nonylphenol Novolac Curing Agent

This example illustrates an improved electrical performance Lead-FreeSolder processable, high T_(g) epoxy laminating resin composed, in part,of an epoxidized DCPD Phenol Novolac polymerized using aPara-Nonylphenol Novolac curing agent.

An identical varnish formulation as in Example 2 was prepared, using aPara-Nonylphenol Novolac with a phenolic equivalent weight of 230 and aMw value of 2488, (born its components according to Table 3 and theprocedures described in Examples 1 and 2. The gel time of this varnishsolution was 210 seconds at 171° C. As described in Examples 1 and 2,this varnish solution was used to impregnate fiberglass cloth, Eachsheet of the resulting prepreg was kept in an air circulating oven for5.00 minutes. The surface appearance of this prepreg was judged to begood containing a few craters and a very slight “orange peel”. Alaminate was then prepared from this prepreg and its properties can befound in Table 4.

This example illustrates the use of a Para-Nonylphenol Novolac curingagent in the preparation of an epoxy resin composition for improvedLead-Free solder processable, high T_(g) electrical laminating resinapplications. Its properties are similar or superior to those providedin Comparative Example 1.

TABLE 4 Results for Comparative Example 1 Along with Examples Formulatedusing Differing Alkylphenol Novolac Curing Agents, Epoxidized DCPDPhenol Novolac, EPON Resin 1163 and EPON Resin 1031 Example Number 1 2 78 Novolac Type Phenolic Octylphenol Para-tertiary- Para- ButylphenolNonylphenol Mw 1540 1715 1134 2488 Composition, parts (grams) EPON Resin1163 30.80 28.34 28.00 28.02 EPON Resin 1031 10.22 3.26 2.99 3.00 EPONResin 154-A-80 38.51 — — — Epoxidized DCPD — 28.54 35.17 25.5 PhenolNovolac Resin (Mw = 1715) Phenolic Novolac 28.17 — — — OctylphenolNovolac — 39.86 — — Para-tertiary-Butylphenol Novolac — — 33.83 —Para-Nonylphenol Novolac — — — 43.48 MEK — 22.93 22.92 11.72 Acetone20.85 16.77 16.83 24.49 PGME 12.21 7.26 7.30 6.65 10% 2MI/90% PGME 0.55.82 4.31 5.35 Prepreg Characteristics Varnish Gel Time (seconds) 191204 210 210 Oven Time (minutes) 3.75 5.25 5.50 5.00 Prepreg Appearanceexcellent marginal poor/marginal good Laminates Characteristics T_(g)(DSC, 2nd Heat) 157 183 185 147

Example 9 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using Epoxidized DCPD Phenol Novolac and aPhysical Blend of a Para-Tertiary-Butylphenol Novolac and OctylphenolNovolac Coring Agent

This example illustrates an improved electrical performance Lead-FreeSolder processable, high T_(g) epoxy laminating resin composed, in part,of an epoxidized DCPD Phenol Novolac polymerized using a physical blendof a Para-tertiary-Butylphenol Novolac and an Octylphenol Novolac curingagent.

An identical varnish formulation as in Example 2 was prepared, using aphysical blend of a Para-tertiary-Butylphenol. Novolac and anOctylphenol Novolac curing agent, from its components according to Table4 and the procedures described in Examples 1 and 2. The gel time of thisvarnish solution was 210 seconds at 171° C. As described in Examples 1and 2, this varnish solution was used to impregnate fiberglass cloth.Each sheet of the resulting prepreg was kept in an air circulating ovenfor 5.00 minutes. The surface appearance of this prepreg was judged tobe good containing a few craters and a very slight “orange peel”. Alaminate was then prepared from this prepreg and its properties can befound in Table 5.

This example illustrates the use of a physical blend of aPara-tertiary-Butylphenol Novolac and an Octylphenol Novolac curingagent in the preparation of an epoxy resin composition for improvedLead-Free solder processable, high T_(g) electrical laminating resinapplications. Its properties are similar or superior to those providedin Comparative Example 1.

TABLE 5 (In Two Parts A & B) Example Number 1 2 7 9 A Results forComparative Example 1, Example 2 Along with an Example Formulated usinga Physical Blend of a Para-tertiary-Butylphenol Novolac and anOctylphenol Novolac Curing Agent, Epoxidized DCPD Phenol Novolac, EPONResin 1163 and EPON Resin 1031 Novolac Type Phenolic OctylphenolPara-tertiary- Physical Blend of Para-tertiary- Butylphenol ButylphenolNovolac and Octylphenol Novolac Mw 1540 1715 1134 50% OctylphenolNovolac at Mw = 1715 50% Para-tertiary- Butylphenol at Mw = 1134Composition, parts (grams) EPON Resin 30.80 28.34 28.00 27.99 1163 EPONResin 10.22 3.26 2.99 3.01 1031 EPON Resin 38.51 — — — 154-A-80Epoxidized — 28.54 35.17 32.16 DCPD Phenol Novolac Resin (Mw = 1040)Phenolic 28.17 — — — Novolac Octylphenol — 39.86 — 18.41 NovolacPara-tertiary- — — 33.83 18.43 Butylphenol Novolac MEK — 22.93 22.9222.92 Acetone 20.85 16.77 16.83 16.84 PGME 12.21 7.26 7.30 7.30 10%2MI/90% 0.5 5.82 4.31 4.78 PGME B Prepreg Characteristics Varnish Gel191 204 210 204 Time (seconds) Oven Time 3.75 5.25 5.50 5.00 (minutes)Prepreg excellent marginal Poor/marginal poor/marginal AppearanceLaminates Characteristics T_(g) (DSC, 2nd 157 183 185 180 Heat)

Example 10 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using Epoxidized DCPD Phenol Novolac and aCo-Novolac Curing Agent Composed of Para-Tertiary-Butylphenol andOctylphenol

This example illustrates an improved electrical performance Lead-FreeSolder processable, high T_(g) epoxy laminating resin composed, in part,of an epoxidized DCPD Phenol Novolac polymerized using a Co-Novolaccuring agent composed of Para-tertiary-Butylphenol and Octylphenol.

A similar varnish formulation as in Example 2 was prepared, using anepoxidized DCPD Phenol Novolac with a WPE of 278 and a Mw value of 1040,from its components according to Table 1 and the procedures described inExample 1, The curing agent used in this composition was a co-Novolaccomposed of Octylphenol and Para-tertiary-Butylphenol with a phenolicequivalent weight of 180 and a Mw value of 1404. The gel time of thisformulation's varnish solution was 196 seconds at 171° C., As describedin Examples 1 and 2, this varnish solution was used to impregnatefiberglass cloth. Each sheet of the resulting prepreg was kept in an aircirculating oven for 5.00 minutes. The surface appearance of thisprepreg was judged to be very poor containing a large number craters anda very high “orange peel”. An illustrative photograph of arepresentative area of this prepreg's surface can be found in FIG. 4.Note that this example was prepared using no oligomeric polybutadieneand thus has a rough surface appearance. A laminate was then preparedusing this prepreg and its properties can be found in Table 6.

This example illustrates the use of a physical blend of aPara-tertiary-Butylphenol Novolac and an Octylphenol Novolac curingagent in the preparation of an epoxy resin composition for improvedLead-Free solder processable, high T, electrical laminating resinapplications. Its properties are similar or superior to those providedin Comparative Example 1.

TABLE 6 (In Two Parts A & B) Example Number 1 2 7 9 10 A Results forComparative Example 1; Along with Formulations Using epoxidized DCPDPhenol Novolac Cured by either an Octylphenol Novolac,Para-tertiary-Butylphenol Novolac, the Physical blend of OctylphenolNovolac/Para-tertiary-Butylphenol Novolac or the Co-Novolae ofPara-tertiary-Butylphenol and Octylphenol Novolac Type PhenolicOctylphenol Para-tertiary- Physical Blend of Co-Novolac of ButylphenolOctylphenol Novolac Octylphenol and and Para-tertiary- Para-tertiary-Butylphenol Novolac Butylphenol. Mw 1715 1134 — 1404 Composition, parts(grams) EPON Resin 30.80 28.34 28.00 27.99 28.00 1163 EPON Resin 10.223.26 2.99 3.01 3.00 1031 EPON Resin 38.51 — — — — 154-A-80 Epoxidized —28.54 35.17 32.16 32.64 DCPD Phenol Novolac Resin (Mw = 1040) Phenolic28.17 — — — — Novolac Octylphenol — 39.86 — 18.41 — NovolacPara-tertiary- — — 33.83 18.43 — Butylphenol Novolac Co-Novolac — — — —36.35 of Octylphenol and Para-tertiary- Butylphenol MEK — 22.93 22.9226.17 11.25 Acetone 20.85 16.77 16.83 13.01 30.84 PGME 12.21 7.26 7.307.30 7.53 10% 0.5 5.82 4.31 4.78 4.82 2MI/90% PGME B Novolac TypePhenolic Octylphenol Para-tertiary- Physical Blend Co-Novolac ofButylphenol of Octylphenol Octylphenol Novolac and and Para-Para-tertiary- tertiary- Butylphenol Butylphenol. Novolac PrepregCharacteristics Varnish Gel 191 204 210 204 196.0 Time (seconds) OvenTime 3.75 5.25 5.50 5.00 5.00 (minutes) Prepreg Excellent fair/marginalpoor/marginal poor/marginal Poor Appearance Laminates CharacteristicsT_(g) (DSC, 2nd 157 183 185 180 185 Heat)

Example 11 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using a Low Molecular Weight Epoxidized DCPDPhenol Novolac, an Octylphenol Novolac Curing Agent and One WeightPercent Oligomeric Polybutadiene

This example illustrates an enhanced surface appearance, improvedelectrical performance Lead-Free Solder processable, high T_(g) epoxylaminating resin composed, in part, of a low molecular weight epoxidizedDCPD Phenol Novolac polymerized using an Octylphenol Novolac curingagent and an oligomeric Polybutadiene at one wt %.

A varnish formulation identical to that of Example 3 was prepared fromits components according to Table 7 and the procedures described inExamples 1 and 2. The curing agent used in this composition was the sameNovolac as in Example 2. However, in this varnish formulation aPolybutadiene oligomeric material at one wt %, solids basis, wasadditionally added. The Polybutadiene had a Mw value of 8490 and a vinylcontent of 70 wt %. The gel time of this varnish solution was 210seconds at 171° C. As described in Examples 1 and 2, this varnishsolution was used to impregnate fiberglass cloth, Each sheet of theresulting prepreg was kept in an air circulating overt for 4.25 minutes.The surface appearance of this prepreg was judged to be excellentcontaining no craters and was very smooth with no “orange peel”. Alaminate was then prepared from this prepreg and its properties can befound in Table 7.

A cured neat resin casting was prepared from dust removed from somethese prepregs, as described in Examples 1 and 2, and its dielectricconstant and dissipation was measured. These measured values can befound in FIGS. 5 and 6.

This example illustrates the use of a one wt %, high vinyl content,oligomeric Polybutadiene in the epoxidized DCPD PhenolNovolac/Alkylphenol Novolac curing agent formulations to prepareenhanced surface appearance, improved Lead-Free solder processable, highT_(g) electrical laminating resins, Its properties are similar orsuperior to those provided in Comparative Example 1.

Example 12 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using a Low Molecular Weight Epoxidized DCPDPhenol Novolac, an Octylphenol Novolac Curing Agent and Two WeightPercent Oligomeric Polybutadiene

This example illustrates an enhanced surface appearance, improvedelectrical performance Lead-Free Solder processable, high T_(g) epoxylaminating resin composed, in part, of a moderate molecular weightepoxidized DCPD Phenol Novolac polymerized using an Octylphenol Novolaccuring agent and an oligomeric Polybutadiene at one wt %.

A varnish formulation identical to that of Example 2 was prepared fromits components according to Table 8 and the procedures described inExamples 1 and 2. The curing agent used in this composition was the sameNovolac as in Example 2. However, in this varnish formulation aPolybutadiene oligomeric material at one wt %, solids basis, wasadditionally added. The Polybutadiene had a Mw value of 8490 and a vinylcontent of 70 wt %. The gel time of this varnish solution was 194seconds at 171° C. As described in Examples 1 and 2, this varnishsolution was used to impregnate fiberglass cloth. Each sheet of theresulting prepreg was kept in an air circulating oven for 5.00 minutes.The surface appearance of this prepreg was judged to be excellentcontaining no craters and was very smooth with no “orange peel”. FIG. 7illustrates the surface appearance of a typical area of this prepreg. Acomparison of this Figure with FIG. 3 demonstrates the significantprepreg surface appearance improvement created by the addition of a highvinyl content, oligomeric Polybutadiene is epoxidized DCPD PhenolNovolac/Alkylphenol Novolac formulations, A laminate was then preparedfrom this prepreg and its properties can be found in Table 8.

This example illustrates the use of a one wt %, high vinyl content,oligomeric Polybutadiene with a moderate Molecular Weight epoxidizedDCPD Phenol Novolac/Alkylphenol Novolac curing agent formulation toprepare enhanced surface appearance, improved Lead-Free solderprocessable, T_(g) electrical laminating resins. Its properties aresimilar or superior to those provided in Comparative Example 1.

TABLE 8 Results for Comparative Example 1; Low Molecular Weight (Example3) and Moderate Molecular Weight (Example 2) Epoxidized DCPD PhenolNovolac, EPON Resin 1163 and EPON Resin 1031 Cured using an OctylphenolNovolac; and, Similar Formulations (Examples 11 and 13) Containing anOligomeric Polybutadiene at One Weight Percent Example Number 1 3 11 212 Novolac Type Phenolic Octylphenol Octylphenol Octylphenol OctylphenolEpoxidized DCPD — 523 523 1040 1040 Phenol Novolac Molecular WeightOligomeric 0 0 1.0 0 1.0 Polybutadiene Content, Weight PercentComposition, parts (grams) EPON Resin 1163 30.80 28.00 28.00 28.00 28.34EPON Resin 1031 10.22 3.00 3.00 3.00 3.26 EPON Resin 154-A- 38.51 — — —— 80 Epoxidized DCPD — 26.71 26.20 26.71 28.54 Phenol Novolac ResinPhenolic Novolac 28.17 — — — — (Mw = 1540) Octylphenol — 42.29 41.8342.29 39.86 Novolac MEK — 26.33 31.25 26.33 21.46 Acetone 20.85 12.494.18 12.49 23.93 PGME 12.21 7.31 6.69 7.31 7.27 10% 2MI/90% 0.5 5.615.65 5.61 5.81 PGME Prepreg Characteristics Varnish Gel Time 191 213 210213 194 (seconds) Oven Time 3.75 4.50 5.25 4.50 5.00 (minutes) PrepregAppearance excellent fair excellent fair excellent LaminatesCharacteristics T_(g) (DSC, 2nd Heat) 157 173 164 173 175

Example 14 Improved Electrical Performance, Lead-Free Processable, HighT_(g) Laminating Resin Using an Epoxidized DCPD Phenol Novolac, EPONResin 1163, EPON Resin 1031 and an Oligomeric Polybutadiene Cured Usinga Co-Novolac Composed of Para-Tertiary-Butylphenol and Octylphenol

A similar varnish formulation as in Example 10 was prepared, usingidentical components, according to Table 9 and the procedures describedin Examples 1 and 2. However, in this varnish formulation aPolybutadiene oligomeric material was additionally added at one wt %,solids basis. The Polybutadiene was the same one used in Examples 11, 12and 13. The gel time of this varnish solution was 200 seconds at 171° C.As described in Examples 1 and 2, this varnish solution was used toimpregnate fiberglass cloth. Each sheet of the resulting prepreg waskept in an air circulating oven for 6.5 minutes. The surface appearanceof this prepreg was judged to be very good containing no craters and avery slight “orange peel”. FIG. 8 illustrates the surface appearance ofa typical area of this prepreg. A comparison of this Figure with FIG. 4demonstrates the significant prepreg surface appearance improvementcreated by the addition of a high vinyl content, oligomericPolybutadiene in epoxidized DCPD Phenol Novolac/Alkylphenol Novolacformulations. A laminate was then prepared from this prepreg and itsproperties can be found in Table 9.

This example illustrates the use of a high vinyl content, oligomericPolybutadiene in a moderate Molecular Weight epoxidized DCPD PhenolNovolac/Alkylphenol Co-Novolac curing agent formulations to prepareenhanced surface appearance, improved Lead-Free solder processable, highT_(g) electrical laminating resins. Its properties are similar orsuperior to those provided in Comparative Example 1.

TABLE 9 (In Two Parts A & B) Example Number 1 12 10 14 A Results forComparative Example 1; Epoxidized DCPD Phenol Novolac, EPON Resin 1163and EPON Resin 1031 Cured using a Co-Novolac of Octylphenol andPara-tertiary- Butylphenol; and, a Similar Formulation Containing anOligomeric Polybutadiene at One Weight Percent Novolac Type PhenolicOctylphenol Co-Novolac of Co-Novolac of Octylphenol and Octylphenol andPara-tertiary- Para-tertiary- Butylphenol Butylphenol Oligomeric 0 1.0 01.0 Polybutadiene Content, Weight Percent Composition, parts (grams)EPON Resin 30.80 28.00 28.00 28.00 1163 EPON Resin 10.22 3.00 3.00 3.001031 EPON Resin 38.51 — — — 154-A-80 Epoxidized — 25.64 32.64 32.68 DCPDPhenol Novolac Resin (Mw = 1715) Phenolic 28.17 — — — Novolac (Mw =1540) Octylphenol — 41.35 — — Novolac (Mw = 1715) Co-Novolac of — —36.35 36.38 Para-tertiary- Butylphenol and Octylphenol (Mw = 1404) MEK —18.10 11.25 11.26 Acetone 20.85 13.81 30.84 30.85 PGME 12.21 6.65 7.537.53 10% 2MI/90% 0.5 5.76 4.82 4.70 PGME B Novolac Type PhenolicOctylphenol Co-Novolac of Co-Novolac of Octylphenol and Octylphenol andPara-tertiary- Para-tertiary- Butylphenol Butylphenol PrepregCharacteristics Varnish Gel 191 223 196.0 200 Time (seconds) Oven Time3.75 5.50 5.00 4.70 (minutes) Prepreg excellent excellent poor excellentAppearance Laminates Characteristics T_(g) (DSC, 2nd Heat) 157 167 185175

Example 15 Improved Electrical Performance Lead-Free Processable, HighT_(g) Laminating Resin Using an Epoxidized DCPD Phenol Novolac, anOctylphenol Novolac Curing Agent and a Different OligomericPolybutadiene

This example illustrates an enhanced surface appearance, improvedelectrical performance Lead-Free Solder processable, high T_(g) epoxylaminating resin composed, in part, of an epoxidized DCPD Phenol Novolacpolymerized using an Octylphenol Novolac Curing agent and alsocontaining an oligomeric Polybutadiene different than the one used inExamples 11, 12, 13 and 14.

A similar varnish formulation as in Example 2 was prepared, usingidentical components, according to Table 10 and the procedures describedin Examples 1 and 2. However, in this varnish formulation aPolybutadiene oligomeric material was additionally added. ThePolybutadiene was different than the one used in Examples 11, 12, 13 and14, This Polybutadiene had a Mw value of 15441 and a vinyl content of 90wt %, The gel time of this varnish solution was 221 seconds at 171° C.As described in Examples 1 and 2, this varnish solution was used toimpregnate fiberglass cloth. Each sheet of the resulting prepreg waskept in an air circulating oven for 4.50 minutes. The surface appearanceof this prepreg was judged to be excellent containing no craters and avery slight “orange peel”. A laminate was then prepared from thisprepreg and its properties can be found in Table 10.

This example illustrates the use of a high vinyl content, oligomericPolybutadiene (different from that used in Examples 11, 12, 13 or 14) inthe epoxidized DCPD Phenol Novolac/Alkylphenol Novolac curing agentformulations to prepare enhanced surface appearance, improved Lead-Freesolder processable, high T_(g) electrical laminating resins. Itsproperties are similar or superior to those provided in ComparativeExample 1.

TABLE 10 (In Two Parts A & B) Example Number 1 3 12 14 A Results forComparative Example 1; Epoxidized DCPD Phenol Novolac, EPON Resin 1163and EPON Resin 1031 Cured using an Octylphenol Novolac; and, SimilarFormulations Containing Two Different Oligomeric Polybutadienes NovolacType Phenolic Co-Novolac of Co-Novolac of Co-Novolac of Para-tertiary-Para-tertiary- Para-tertiary- Butylphenol and Butylphenol andButylphenol and Octylphenol Octylphenol Octylphenol Oligomeric — — #1 #2Polybutadiene Type Composition, parts (grams) EPON Resin 30.80 28.0028.00 28.00 1163 EPON Resin 10.22 3.00 3.00 3.00 1031 EPON Resin 38.51 —— — 154-A-80 Epoxidized — 26.71 25.64 26.17 DCPD Phenol Novolac Resin(Mw = 1715) Phenolic 28.17 — — — Novolac (Mw = 1540) Co-Novolac of —42.29 41.35 41.84 Para-tertiary- Butylphenol and Octylphenol Novolac (Mw= 1404) MEK — 26.33 18.10 22.53 Acetone 20.85 12.49 13.81 12.92 PGME12.21 7.31 6.65 6.65 10% 2MI/90% 0.5 5.61 5.76 5.65 PGME B Novolac TypePhenolic Co-Novolac of Co-Novolac of Co-Novolac of Para-tertiary-Para-tertiary- Para-tertiary- Butylphenol and Butylphenol andButylphenol and Octylphenol Octylphenol Octylphenol Oligomeric — — #1 #2Polybutadiene Type Prepreg Characteristics Varnish Gel 191 213 223 221Time (seconds) Oven Time 3.75 4.50 5.50 5.50 (minutes) Prepreg excellentfair excellent Excellent Appearance Laminates Characteristics T_(g)(DSC, 2nd 157 173 167 165 Heat)

What is claimed is:
 1. An epoxy resin composition comprising: an epoxyresin component; an epoxidized cycloaliphatic dicyclopentadiene phenolicresin; an alkylphenol novolac resin; and an oligomeric butadienehomopolymer of butadiene having a weight average molecular weight (Mw)from about 1,000 Daltons to about 20,000 Daltons.
 2. The epoxy resincomposition of claim 1 further comprising an epoxidized bisphenol-Anovolac resin.
 3. The epoxy resin composition of claim 1 wherein theepoxy resin component is present, as a weight percentage of thecomposition, from about 30 wt % to about 80 wt %.
 4. The epoxy resincomposition of claim 1 wherein epoxidized cycloaliphaticdicyclopentadiene phenolic resin utilized in the composition is producedfrom an epihalohydrin and a dicyclopentadiene polyphenolic compoundhaving the general formula:

wherein “n” represents a whole number from 0 to 7; Ph is a phenylolradical derived from mononuclear phenol, and D is a tricyclodecyleneradical having a general formula:


5. The epoxy resin composition of claim 1 wherein the epoxidizedcycloaliphatic dicyclopentadiene phenolic resin is present, as a weightpercentage of the composition, from about 5 wt % to about 70 wt %. 6.The epoxy resin composition of claim 2 wherein the epoxidizedbisphenol-A novolac resin component is present, as a weight percentageof the composition, from about 10 wt % to about 40 wt %.
 7. The epoxyresin composition of claim 1 wherein the oligomeric butadiene componentis present, as a weight percentage of the composition, from about 0.05wt % to about 4 wt %.
 8. The epoxy resin composition of claim 1 furthercomprising a solvent component, and the solvent component is present, asa weight percentage of the composition, from about 15 wt % to about 50wt %.
 9. The epoxy resin composition of claim 1 wherein the alkylphenolnovolac resin serving as the curing agent has the general formula:

where: Ar represents an aryl or alkyl-aryl group; each Ar group containsx number of non-aromatic carbon atoms, OH represents a hydroxyl groupbonded to each Ar group, each R¹ represents substituent group(s) bondedto each Ar group, each R² represents a group connecting adjacent Argroups, n is a number between 2 and 20, x is an integer from 4 to 8, yis an integer from 1 to x−2, and z is an integer from 1 to x−3.
 10. Theepoxy resin composition of claim 1 wherein the alkylphenol novolac resinserving as the curing agent has the general formula:

wherein: R¹ represents a single alkyl substituent in the para positionhaving from 4 to 9 carbon atoms and is sometimes a butyl or octyl groupand R² is a methyl group.
 11. The epoxy resin composition of claim 1wherein a ratio of the total epoxy groups to the phenolic hydroxylequivalents is between about 0.5 to about 1.5.
 12. The epoxy resincomposition of claim 1 wherein the oligomeric butadiene homopolymercomprises a 1,2 vinyl group content from about 25 to about 99 percent.13. The epoxy resin composition of claim 1 wherein the composition, whencured, has a T_(g) of about 150° C. or greater and a T_(d) of 300° C. orgreater.
 14. A process for forming a composition, comprising: providingan epoxy resin and an epoxidized cycloaliphatic dicyclopentadienephenolic resin to a reactor to form a mixture; and providing anoligomeric butadiene homopolymer and an alkylphenol novolac resin to themixture.
 15. The process of claim 14, wherein: the epoxy resin ispresent, as a weight percentage, from about 30 wt % to about 80 wt %;the epoxidized cycloaliphatic dicyclopentadiene phenolic resin ispresent, as a weight percentage of the composition, from about 5 wt % toabout 70 wt %; the epoxidized bisphenol-A novolac resin component ispresent, as a weight percentage of the composition, from about 10 wt %to about 40 wt %; and the oligomeric butadiene component is present, asa weight percentage of the composition, from about 0.05 wt % to about 4wt %; and wherein the total amount of components is 100 wt. %.
 16. Theprocess of claim 14, wherein the process further comprises adding asolvent component with the providing the epoxy resin and the epoxidizedcycloaliphatic dicyclopentadiene phenolic resin, adding a solventcomponent with the providing the oligomeric butadiene homopolymer andthe alkylphenol novolac resin, or both.
 17. The process of claim 16,wherein the solvent component is present, as a weight percentage of thecomposition, from about 15 wt % to about 50 wt %.
 18. The process ofclaim 14, further comprising impregnating a substrate with thecomposition.